Technology & IT | Saturday 22 August, 2015 1:08 am |

Panasonic Corporation today announced that it has developed the industry’s first*1 “electromagnetic noise suppression and heat diffusion integrated sheets”, which are suited for thermal and electromagnetic noise (EMC) reduction for thin mobile terminals, on-board equipment, and industrial equipment. The sheets have electromagnetic noise suppression properties as well as the highest level*2 of heat diffusion properties in the industry, and are thin and flexible so that they can be used in a very limited space. Full-scale sample delivery is planned to commence in September 2017, and order placement is offered from September 2018.
*1 As of August 18, 2015 (based on our internal research)
*2 As of August 18, 2015, as a thermal diffusion sheet (based on our internal research) 

Semiconductors and batteries within mobile terminals and on-board equipment are potential sources of heat or electromagnetic noise, which may reduce receiving sensitivity or cause malfunction of equipment. In addition, such terminals and equipment are required to become even smaller and thinner, requiring countermeasures against thermal and electromagnetic noise when they are used within the limited space available in the equipment. 

We have successfully produced this sheet by developing the following technologies: 

Dispersion/compression processing technology to allow a high-density orientation of homogeneous magnetic metal particles into resins 

Lamination technology to improve heat diffusion and noise suppression properties 

Not only can this sheet function on its own as a countermeasure against heat and electromagnetic noise, but thanks to its thinness and flexibility, it can also be inserted into the narrow spaces within the housing of electronic equipment.